Thermite® TVC-3.0 Model 1100
High Performance in Any Environment
The Thermite TVC-3.0 Model 1100 offers state-of-the-art embedded computing, mobile graphics, and conduction cooling, delivering unparalleled graphics and
processor performance for rugged battlefield applications. The Thermite TVC-3.0 Model 1100 is perfect for high-performance computing, advanced graphics, shader-based rendering, and GPGPU processing in a compact form factor for any environment.
The Thermite TVC-3.0 Difference
The Thermite TVC-3.0 features a 1.6 GHz Intel® Core 2 Duo processor with a Nvidia® FX770M GPU for superior compute and graphics processing performance, making it ideal for performance rich applications in battlefield, ground, air and maritime environments.
Processing Powerhouse
The Thermite TVC-3.0 Model 1100 with a CUDA-capable GPU can handle accelerated GPGPU operations to solve complex compute-intensive applications in the most demanding of environments. The Thermite TVC-3.0 is perfect for field-based training, situational awareness, sensor processing/display, mission planning, mission rehearsal, weapon system control, maintenance, and other augmented reality simulations. CUDA is a general purpose parallel computing architecture that leverages the parallel compute engine in Nvidia graphics processing units to solve many complex computational problems in a fraction of the time required on a CPU. The fast parallel computing architecture is easily accessed using the most common programming languages in use today. The Thermite TVC-3.0 brings capabilities of the most powerful PC workstations to the battlefield—for deployment on Ground Vehicles, Aircraft, Maritime, or other vehicles
| Aggressive Performance |
Intel® Core 2 Duo LV processor and a CUDA-enabled GPU |
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| 3D Graphics |
NVIDIA® Quadro® FX770M GPU for visual rich applications |
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| Power Efficient |
Dynamic power control manages power consumption and thermal dissipation |
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| Versatile I/O |
Built-in USB, RS-232, RS-422, and Gigabit Ethernet |
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| Rugged |
Designed to work in the most demanding field environments |
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| Storage for your needs |
Drive size and drive type to suit your needs |
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| Video Capture |
Advanced PCIe-based video capture and processing options |
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| CPU |
Manufacturer |
Intel |
| Class |
Core 2 Duo LV |
| Clock |
1.6 GHz |
| L2 Cache |
Up to 4MB |
| Chipset |
Intel 965GME “Santa Rosa” MCH, ICH8-M |
| System Memory |
Type |
DDR2 |
| Capacity |
4GB dual-channel |
| Graphics Processor |
Processor |
Nvidia® Quadro FX770 Graphics Module |
| Frame Buffer |
256MB DDR2 DRAM |
| GPU Module |
32-Core |
| Interface |
PCIe x16 |
| Operating System |
Standard |
Microsoft® Windows® XP Embedded |
| Removable Storage |
Options |
128 GB Solid State Drive |
| Standard Interfaces |
USB 2.0 |
2 |
| VGA |
1 |
| PCIe video capture |
1 |
| RS-232C |
2 |
| RS-422 |
1 Asynchronous, 1 Synchronous (SDLC) |
| IEEE 802.3 10/100/1000 Ethernet |
1 |
| Power/Performance |
Supply |
10-36VDC (10.5 - 30 volts DC) with Advanced power-saving technologies |
| Standards |
MIL-STD-704F, STANAG 1008 and MIL-STD 1275 |
| Dimensions |
Width |
244 mm (9.6 in) |
| Height |
160 mm (6.3 in) |
| Depth |
81.5 mm (3.2 In) |
| Weight |
4 kg (8.8 lbs) |
| Environmental |
Ambient Temperature |
-25° C to +62° C (operating), -40° C to +85° C (non-operating) |
| Humidity Level |
5% - 90%, NC (operating), 5% - 95%, NC (non-operating) |
| Altitude Level |
-200 to 40,000 ft |
| Vibration Resistance |
Up to 12 G RMS |
| Shock Resistance |
Up to 40 G |
| Immersion Resistance |
1m for 30 minutes |
| Note |
Subject to validation testing, and subject to change at any time. |
