Thermite® TVC-3.0 Model 1100

High Performance in Any Environment

The Thermite TVC-3.0 Model 1100 offers state-of-the-art embedded computing, mobile graphics, and conduction cooling, delivering unparalleled graphics and processor performance for rugged battlefield applications. The Thermite TVC-3.0 Model 1100 is perfect for high-performance computing, advanced graphics, shader-based rendering, and GPGPU processing in a compact form factor for any environment.

The Thermite TVC-3.0 Difference

The Thermite TVC-3.0 features a 1.6 GHz Intel® Core 2 Duo processor with a Nvidia® FX770M GPU for superior compute and graphics processing performance, making it ideal for performance rich applications in battlefield, ground, air and maritime environments.

Processing Powerhouse

The Thermite TVC-3.0 Model 1100 with a CUDA-capable GPU can handle accelerated GPGPU operations to solve complex compute-intensive applications in the most demanding of environments. The Thermite TVC-3.0 is perfect for field-based training, situational awareness, sensor processing/display, mission planning, mission rehearsal, weapon system control, maintenance, and other augmented reality simulations. CUDA is a general purpose parallel computing architecture that leverages the parallel compute engine in Nvidia graphics processing units to solve many complex computational problems in a fraction of the time required on a CPU. The fast parallel computing architecture is easily accessed using the most common programming languages in use today. The Thermite TVC-3.0 brings capabilities of the most powerful PC workstations to the battlefield—for deployment on Ground Vehicles, Aircraft, Maritime, or other vehicles

Aggressive Performance Intel® Core 2 Duo LV processor and a CUDA-enabled GPU
3D Graphics NVIDIA® Quadro® FX770M GPU for visual rich applications
Power Efficient Dynamic power control manages power consumption and thermal dissipation
Versatile I/O Built-in USB, RS-232, RS-422, and Gigabit Ethernet
Rugged Designed to work in the most demanding field environments
Storage for your needs Drive size and drive type to suit your needs
Video Capture Advanced PCIe-based video capture and processing options
CPU Manufacturer Intel
Class Core 2 Duo LV
Clock 1.6 GHz
L2 Cache Up to 4MB
Chipset Intel 965GME “Santa Rosa” MCH, ICH8-M
System Memory Type DDR2
Capacity 4GB dual-channel
Graphics Processor Processor Nvidia® Quadro FX770 Graphics Module
Frame Buffer 256MB DDR2 DRAM
GPU Module 32-Core
Interface PCIe x16
Operating System Standard Microsoft® Windows® XP Embedded
Removable Storage Options 128 GB Solid State Drive
Standard Interfaces USB 2.0 2
PCIe video capture 1
RS-232C 2
RS-422 1 Asynchronous, 1 Synchronous (SDLC)
IEEE 802.3 10/100/1000 Ethernet 1
Power/Performance Supply 10-36VDC (10.5 - 30 volts DC) with Advanced power-saving technologies
Standards MIL-STD-704F, STANAG 1008 and MIL-STD 1275
Dimensions Width 244 mm (9.6 in)
Height 160 mm (6.3 in)
Depth 81.5 mm (3.2 In)
Weight 4 kg (8.8 lbs)
Environmental Ambient Temperature -25° C to +62° C (operating), -40° C to +85° C (non-operating)
Humidity Level 5% - 90%, NC (operating), 5% - 95%, NC (non-operating)
Altitude Level -200 to 40,000 ft
Vibration Resistance Up to 12 G RMS
Shock Resistance Up to 40 G
Immersion Resistance 1m for 30 minutes
Note Subject to validation testing, and subject to change at any time.

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